By introducing distributed polarisation-doping, it is possible to produce current-injection deep-UV lasers. Building on this ...

Semiconductor fabrication is a discipline defined by extreme precision, where each stage must meet demanding tolerances to ...

The emerging convergence of AI-first design principles and environmental consciousness is reshaping how we think about ...

Developers of gallium oxide power devices should draw on lessons learnt from the pioneers of compound semiconductor MOSFETs.

The company, along with others, is pursuing a new paradigm for cramming more transistors on chips—building up.

A new approach to designing a synchronous rectifier will help engineers unlock efficiency gains that extend beyond ...

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

Researchers introduced intrinsically nonlocal metamaterials, demonstrating that nanoscale semiconductor layering can shape a ...

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

A Berlin-based team from HZB and Center for the Science of Materials Berlin (CSMB) at Humboldt-Universität zu Berlin has set a new record for a tandem solar cell. Using a combination of a CIGS ...

A tandem solar cell combining CIGS and perovskite semiconductors has set a new efficiency record, demonstrating the potential ...