Healthcare facilities need to consider materials, fire codes, and design features when integrating emergency responder communication systems.

As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the ...

The data connection device under test in Figure 1 is characterized by comparing test signals sent into the link with signals measured at the link output. The differences between these two test signals ...

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of ...

Engineers at the University of Pennsylvania have successfully sent quantum signals over a standard internet connection with fiber-optic cables in the real world. The researchers have published their ...

As the number of higher-throughput applications grows, so does the need for a wider bandwidth and network coverage in wireless systems. Given limited spectrum allocation, wireless communication ...

A tough challenge for test engineers is explored in terms of test methods, pitfalls, and measurement errors. For the test engineer, RF and microwave power amplifier testing imposes unique challenges.