Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Ever since automated optical inspection (AOI) became a mainstay of a manufacturer's test strategy, planners have debated where to place it in the production process. Do you inspect the solder paste ...

The use of AOI (automated optical inspection) systems with dual-lane configurations is increasing in high-speed PCB (printed-circuit board) assembly, due to the systems’ ability to double capacity in ...

Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...

Automated optical inspection (AOI) and automated X-ray inspection (AXI) have been around for some time in various configurations and both have played a role in improving the quality of circuit boards.

One high-volume OEM proves that even simple feedback from an AOI system can reduce end-of-line defects by an order of magnitude. Until recently, the use of pre-reflow optical inspection usually was ...

The wire blank shoots from the drawing die which molds it into the desired shape. Up to ten meters per second, the workpiece is fast – and thus can keep pace with world-class runners like Usain Bolt.

Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...