New 3D-printed copper technology offers a high-efficiency solution to the data center power crisis. University of Illinois Urbana-Champaign researchers developed a computer-chip-cooling technology by ...

Dense array of rough copper pillars on a copper plate. A new 3D-printed cold plate used for liquid-cooling high-power computer chips consists of an array of computationally designed, bumpy copper ...

A University of Illinois Urbana-Champaign team published research showing 3D-printed pure copper cooling plates could reduce data center cooling energy use from 30-40% of total power draw to just 1.1% ...

Mechanical engineers have designed a more effective and energy-efficient technology for cooling computer chips. Publishing May 7 in the Cell Press journal Cell Reports Physical Science, the ...